Feuerwizard
April 26th, 2004, 09:49 am
http://www.cooltechzone.com/images/intel_logo.JPG
Intel Corporation, world's largest chip maker, announced a construction project that the company has taken to convert a 200mm wafer fabrication to a 300mm fabrication. The facility will be located in Chandler, Arizona and the project is expected to cost around $2 billion. The chip giant expects to finish the project by late 2005 and will be the key center for 65nm process technology.
Bob Barker, Intel's Senior Vice President and General Manager, Technology and Manufacturing Group, confirmed to Xbit Labs that this is Intel's very first conversion of a 200mm wafter fab to a 300mm fab.
This will be Intel's fifth 300mm fab facility. The other four fab facilities are located worldwide including Oregon and Ireland.
The details on Intel's 65nm process technology haven't been revealed, however, there are some key points that must be noted.
According to Xbit Labs, Intel's new 65nm process will carry only 35nm long transistors. Without a doubt, they will be the smallest transistors as of current and will also help gain significant performance.
Next, the chip maker will integrate the second-generation version of its strained silicon in the process technology.
Intel is working on getting it's processors to consumer less power and the 65nm process looks very promising according to the information acquired by CoolTechZone. The process technology will use eight copper interconnect layers and a low-k dielectric material to strenghten the signal strength and reduce heat output.
The new technology is expected to be released around Q3 or Q4 2005.
Intel Corporation, world's largest chip maker, announced a construction project that the company has taken to convert a 200mm wafer fabrication to a 300mm fabrication. The facility will be located in Chandler, Arizona and the project is expected to cost around $2 billion. The chip giant expects to finish the project by late 2005 and will be the key center for 65nm process technology.
Bob Barker, Intel's Senior Vice President and General Manager, Technology and Manufacturing Group, confirmed to Xbit Labs that this is Intel's very first conversion of a 200mm wafter fab to a 300mm fab.
This will be Intel's fifth 300mm fab facility. The other four fab facilities are located worldwide including Oregon and Ireland.
The details on Intel's 65nm process technology haven't been revealed, however, there are some key points that must be noted.
According to Xbit Labs, Intel's new 65nm process will carry only 35nm long transistors. Without a doubt, they will be the smallest transistors as of current and will also help gain significant performance.
Next, the chip maker will integrate the second-generation version of its strained silicon in the process technology.
Intel is working on getting it's processors to consumer less power and the 65nm process looks very promising according to the information acquired by CoolTechZone. The process technology will use eight copper interconnect layers and a low-k dielectric material to strenghten the signal strength and reduce heat output.
The new technology is expected to be released around Q3 or Q4 2005.